发明名称 |
THERMAL INTERFACE MATERIAL, TEST STRUCTURE AND METHOD OF USE |
摘要 |
Non-corrosive thermal interface materials for use in a test structure and method of use. The test structure includes a heat sink for dissipating heat away from a device under test. The test structure further includes a non-corrosive thermal interface material disposed between the heat sink and the device under test. The non-corrosive thermal interface material is capable of withstanding test conditions for at least 60 minutes for at least 115° C. without staining or leaving residue on the device under test after baking.
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申请公布号 |
US2011267084(A1) |
申请公布日期 |
2011.11.03 |
申请号 |
US20100770948 |
申请日期 |
2010.04.30 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ERWIN BRIAN M.;GARDELL DAVID L.;HUMENIK JAMES N.;KUMAR RAJNEESH;LAWSON JOHN |
分类号 |
G01R31/02;G01R31/10 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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