| 摘要 |
<p>Provided is a polyamide resin which, compared to polyoxamide resins of the prior art, can adequately maintain relative viscosity ?r (high molecular weight), moldable temperature range that can be estimated from the temperature differential (Td - Tm), heat resistance that can be estimated from the melting point Tm, molten moldability that can be estimated from the temperature differential (Tm - Tc), and low water-absorbency. The polyamide resin is obtained by bonding units derived from dicarboxylic acid, and units derived from diamine. The dicarboxylic acid contains oxalic acid (compound A), and the diamine contains 1,6-hexane diamine (compound B) and 2-methyl-1, 5-pentane diamine (compound C).</p> |
