| 摘要 |
This disclosure is directed to devices, systems, and methods associated with a passive heat exchanger using thermally conductive foam. With reference to some systems the thermally conductive foam is positioned between a heat source and a heat dissipater to lower an operating temperature. With reference to other systems the thermally conductive foam is positioned between a component to be heated and a heat source to increase an operating temperature. Some embodiments of the thermally conductive foam are substantially pliable, other embodiments of the thermally conductive foam are substantially rigid, and other embodiments of the thermally conductive foam are initially fluid. Some devices related to the present disclosure include thermally conductive foam having thermally conductive particles within the thermally conductive foam.
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