发明名称 LED BARE CHIP
摘要 PURPOSE: An LED bare chip is provided to integrate a light emitting device and thermoelectric device by welding, thereby effectively emitting heat generated from the light emitting device. CONSTITUTION: A thermoelectric device layer(12) is placed on a substrate(11). A first semiconductor layer(13) is placed on the thermoelectric device layer. A light emitting layer(15) is placed on the first semiconductor layer. A second semiconductor layer(17) is placed on the light emitting layer. A second electrode(23) is placed on the second semiconductor layer.
申请公布号 KR20110119916(A) 申请公布日期 2011.11.03
申请号 KR20100039333 申请日期 2010.04.28
申请人 YOON, IN SUK 发明人 YOON, IN SUK;YANG, YOUNG JUN
分类号 H01L33/64;H01L35/00 主分类号 H01L33/64
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