摘要 |
PURPOSE: An LED bare chip is provided to integrate a light emitting device and thermoelectric device by welding, thereby effectively emitting heat generated from the light emitting device. CONSTITUTION: A thermoelectric device layer(12) is placed on a substrate(11). A first semiconductor layer(13) is placed on the thermoelectric device layer. A light emitting layer(15) is placed on the first semiconductor layer. A second semiconductor layer(17) is placed on the light emitting layer. A second electrode(23) is placed on the second semiconductor layer.
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