| 摘要 |
<p>Disclosed is a photosensitive resin composition which has high film retention ratio after development and high sensitivity, while exhibiting high elongation degree and high storage stability. Specifically disclosed is a photosensitive resin composition which contains a hydroxy polyamide resin (A) and a photoacid generator (B). The hydroxy polyamide resin (A) has at least one structure selected from the group consisting of structures represented by general formula (1) (wherein Z1, Z2 and Z3 each independently represents a divalent organic group, and at least one of the Z1, Z2 and Z3 has an alicyclic structure or an aliphatic structure; and m1 represents an integer of 0 or 1) and structures represented by general formula (2) (wherein Z1, Z2 and Z3 each independently represents a divalent organic group, and at least one of the Z1, Z2 and Z3 has an alicyclic structure or an aliphatic structure; and m1 represents an integer of 0 or 1).</p> |
