发明名称 Probe Pad On A Corner Stress Relief Region In A Semiconductor Chip
摘要 A semiconductor chip includes a circuit region and a corner stress relief (CSR) region. The CSR region is in a corner of the semiconductor chip. A device under test (DUT) structure or a functional circuit is disposed on the circuit region. A probe pad is disposed on the CSR region. A metal line extends from the circuit region to the CSR region to electrically connect the probe pad to the DUT structure or a functional circuit.
申请公布号 US2011266541(A1) 申请公布日期 2011.11.03
申请号 US201113180304 申请日期 2011.07.11
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 YANG CHUNG-YING;CHEN HSIEN-WEI
分类号 H01L23/48 主分类号 H01L23/48
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