发明名称 |
Probe Pad On A Corner Stress Relief Region In A Semiconductor Chip |
摘要 |
A semiconductor chip includes a circuit region and a corner stress relief (CSR) region. The CSR region is in a corner of the semiconductor chip. A device under test (DUT) structure or a functional circuit is disposed on the circuit region. A probe pad is disposed on the CSR region. A metal line extends from the circuit region to the CSR region to electrically connect the probe pad to the DUT structure or a functional circuit.
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申请公布号 |
US2011266541(A1) |
申请公布日期 |
2011.11.03 |
申请号 |
US201113180304 |
申请日期 |
2011.07.11 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YANG CHUNG-YING;CHEN HSIEN-WEI |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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