发明名称 LASER SEALING DEVICE FOR GLASS SUBSTRATES
摘要 The present invention relates to a laser sealing device for glass substrates. The present invention comprises: a first laser head which is for irradiating a laser onto and thereby melting a sealing material coated between glass substrates; and a second laser head which is provided at a predetermined interval from the first laser head, irradiates a laser onto the portion which has been irradiated by the first laser head, and is set to a lower power than the first laser head. Further, the invention also comprises a heating plate which is provided so as to be able to move relative to the first and second laser heads and on which the glass substrates are placed when heated to a predetermined temperature. Thus the present invention has the advantageous effect of minimising the occurrence of cracking in the glass substrates due to thermal shock since the temperature of the sealing material which is melted by the laser heads drops slowly rather than dropping rapidly.
申请公布号 WO2011062408(A3) 申请公布日期 2011.11.03
申请号 WO2010KR08103 申请日期 2010.11.16
申请人 LG HAUSYS, LTD.;NO, DONGHUN;CHO, HYUN YOUNG 发明人 NO, DONGHUN;CHO, HYUN YOUNG
分类号 C03C27/12;C09J5/00 主分类号 C03C27/12
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