| 摘要 |
In order to be able to conveniently remove a wafer (4) from a wafer pocket (1), it is proposed that the wafer pocket (1) is formed by a first enveloping film (9) and a second enveloping film (11), which are connected to one another via at least one connecting region (2), such that a wafer accommodating compartment (3) which is suitable for accommodating the wafer (4) and which is closed off towards the outside is formed between the first enveloping film (9) and the second enveloping film (11), wherein at least one of the enveloping films (9, 11) is weakened within a weakening region (5) situated in the region of the wafer accommodating compartment (3), such that the wafer accommodating compartment (3) can be opened by tearing open the wafer pocket (1) along a tearing line that passes the weakening region (5). In order furthermore to ensure that the outer sides of the wafer pocket (1) are aesthetically attractive and can meet the requirements made of necessary identification obligations, the weakening region (5) is spaced apart from each edge of the wafer packet (1). Moreover, the tearing line additionally runs partly outside the weakening region.
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