PHOTONIC DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

摘要

The present invention provides a method for manufacturing a photonic device package module, which can be configured to minimize thermal resistance and to immediately emit generated heat through a heat sink. The method for manufacturing the photonic device package module of the present invention comprises the steps of: preparing a board-shaped metal substrate; oxidizing one side of the metal substrate to the depth of 10-100?, and forming a metal oxide layer; removing a part of the metal substrate to the metal oxide layer from the opposite side of the metal oxide layer, and forming a mounting space having a reflector; forming an insulation layer on an upper side of the metal substrate, and forming a connection wire; mounting a photonic device in the mounting space of the metal substrate, and connecting an electrode of the photonic device with the connection wire; forming a molding layer which is filled in the mounting space and is covered to protect the photonic device and the connection wire; removing the metal oxide layer; forming a solder layer; and mounting the metal substrate on the heat sink.