发明名称 |
HOUSING FOR A SURFACE-MOUNTABLE LIGHT-EMITTING COMPONENT, SURFACE-MOUNTABLE LIGHT-EMITTING COMPONENT AND DISPLAY OR ILLUMINATION SYSTEM USING A PLURALITY OF SURFACE-MOUNTABLE LIGHT-EMITTING COMPONENTS |
摘要 |
<p>A leadframe for a surface-mountable radiation-emitting component, preferably a light-emitting diode component, having at least one chip connection region and at least one external connection strip. The leadframe is formed in planar fashion and a deformation element, preferably a spring element, is arranged between the chip connection region and the external connection strip. The deformation element enables an elastic or plastic deformation of the leadframe in the plane of the leadframe. A housing, a surface-mountable component and an arrangement having a plurality of such components are furthermore specified.</p> |
申请公布号 |
EP1435118(B1) |
申请公布日期 |
2011.11.02 |
申请号 |
EP20020767077 |
申请日期 |
2002.08.02 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
ARNDT, KARLHEINZ;BOGNER, GEORG;WAITL, GUENTER |
分类号 |
H01L33/48;H01L33/60;H01L33/62 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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