发明名称 HOUSING FOR A SURFACE-MOUNTABLE LIGHT-EMITTING COMPONENT, SURFACE-MOUNTABLE LIGHT-EMITTING COMPONENT AND DISPLAY OR ILLUMINATION SYSTEM USING A PLURALITY OF SURFACE-MOUNTABLE LIGHT-EMITTING COMPONENTS
摘要 <p>A leadframe for a surface-mountable radiation-emitting component, preferably a light-emitting diode component, having at least one chip connection region and at least one external connection strip. The leadframe is formed in planar fashion and a deformation element, preferably a spring element, is arranged between the chip connection region and the external connection strip. The deformation element enables an elastic or plastic deformation of the leadframe in the plane of the leadframe. A housing, a surface-mountable component and an arrangement having a plurality of such components are furthermore specified.</p>
申请公布号 EP1435118(B1) 申请公布日期 2011.11.02
申请号 EP20020767077 申请日期 2002.08.02
申请人 OSRAM OPTO SEMICONDUCTORS GMBH 发明人 ARNDT, KARLHEINZ;BOGNER, GEORG;WAITL, GUENTER
分类号 H01L33/48;H01L33/60;H01L33/62 主分类号 H01L33/48
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