ＬＥＤ基板结构,申请号TW100211766-传众专利搜索

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发明名称	ＬＥＤ基板结构
摘要
申请公布号	TWM415425	申请公布日期	2011.11.01
申请号	TW100211766	申请日期	2011.06.28
申请人	台燿科技股份有限公司新竹縣竹北市博愛街803號	发明人	张仲琦;萧智砺
分类号	H01L33/64	主分类号	H01L33/64
代理机构		代理人	陈翠华台北市松山区南京东路3段261号6楼
主权项	一种LED基板结构，包括：一电路板，具有一上表面、与该上表面相对之一下表面及复数容置孔；复数LED元件，各具有一电极部及一基座，该等LED元件系由该下表面设置于该等容置孔，且该等LED元件系利用该电极部与该电路板电性连接；以及一终端散热机构，用以承载该电路板及该等LED元件；其中，该等LED元件系利用该基座贴合于该终端散热机构，且该电路板未与该终端散热机构接触。
地址	新竹县竹北市博爱街803号

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