发明名称 |
Heat spreader for semiconductor package |
摘要 |
A heat spreader (50) for a semiconductor package (100) includes a heat dissipating portion (52) having a recessed periphery (54). A thermosetting resin (58) is disposed in the recessed periphery (54). The heat spreader (50) may include a heat absorbing portion (56) coupled to the heat dissipating portion (52).
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申请公布号 |
US8049313(B2) |
申请公布日期 |
2011.11.01 |
申请号 |
US20060533410 |
申请日期 |
2006.09.20 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
FOONG CHEE SENG;HO KIM CHIEW |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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