| 摘要 |
PROBLEM TO BE SOLVED: To provide a casing for a LED (light-emitting diode)-lighting system, having improved heat radiation and insulation, and reduced mass.SOLUTION: The casing for the LED lighting system 10 is mounted with a light-emitting element 20 as at least one of a LED chip and a LED package having the LED chip and includes a heat conductive thermoplastic resin molded product 11, having a load deflection temperature of 100°C or higher and a volume specific resistance of 10(Ω cm) or higher, and is bonded to the light-emitting element at a temperature of 150°C or lower, and a conductive member 12 provided on the thermoplastic resin molded product 11. |
