| 摘要 |
PROBLEM TO BE SOLVED: To enable a molding die to be repeatedly molded by reproducing the molding die in the molding die for resin molding.SOLUTION: A protective film 23 having resistance to an etching liquid and a film thickness of 10 nm or higher and 100 nm or lower is installed between an intermediate film 24 which is covalently bonded with a release film 25, and a transfer surface processing layer 22 and a body section 21 which constitute the die matrix. Therefore, when the release film 25 is removed by the etching liquid together with the intermediate film 24, the transfer surface processing layer 22 and so forth can be protected from the etching liquid. Thus, even in the molding die 40 of a type wherein the adhering property of the release film 25 has been increased by the intermediate film 24 of the substrate, the reproduction of the molding die wherein the intermediate film 24 and the release film 25 are removed once and formed again becomes possible. In this case, since the protective film 23 has the thickness of 10 nm or higher and 100 nm or lower which is comparatively thin, the shape of the matrix transfer surface 22a in the transfer surface processing layer 22 or the like is maintained, and the transfer accuracy can be increased. |
