| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold release film that has embedding characteristics better than those of the conventional PBT mold release film while preventing tight adhesion between a circuit exposure film of a mold release layer and a CL (cover layer) film and between the mold release layers when the CL film is adhered to the circuit exposure film.SOLUTION: The mold release film has a mold release layer and a cushion layer at the least. The mold release film is characterized in that the blocking force (according to ASTM D1899) is >0.1 N/cm and <1.0 N/cm when the mold release layers of two mold release films are press-fixed to each other for 30 minutes at 170°C under 3 MPa. |
