POLYAMIC ACID SOLUTION, POLYIMIDE RESIN, AND FLEXIBLE COPPER CLAD LAMINATE USING SAME

摘要

The present invention relates to a polyamic acid solution comprising: (a) an aromatic tetracarboxylic acid dianhydride comprising 3,3',4,4'-biphenyltetracarboxylic acid dianhydride (BPDA) and pyromellitic dianhydride (PMDA); (b) an aromatic diamine; and (c) a solvent, and a polyimide resin prepared by imidization of the polyamic acid solution. A flexible copper clad laminate with excellent flexibility can be prepared by using the polyimide resin.