| 摘要 |
PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si-Co copper alloy which has an improved spring critical value.SOLUTION: The copper alloy for the electronic material contains, by mass, 1.0 to 2.5% Ni, 0.5 to 2.5% Co and 0.3 to 1.2% Si, with the balance comprising Cu and inevitable impurities, wherein as a result obtained from X-ray diffraction pole figure measurement based on a rolling face, among the diffraction peak intensities in the {111}Cu face to the {200}Cu face by β scanning in α=35°, the peak height of βangle 90° is ≥2.5 times that of the standard copper powder. |
