发明名称 MOLD ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a mold assembly capable of uniformly heating an entire mold.SOLUTION: The mold assembly is configured to obtain a foamed molding by filling foaming synthetic resin in a molding space S formed by abutting front face side abutting faces of a pair of molds 2, 3 with each other, and heat molding the foaming synthetic resin in the molding space S by supplying steam into steam chambers 6, 9 partitioned by a wall surrounding back face sides of the molds 2, 3. A steam supply means supplies steam into the steam chambers from a one side 4A configuring the wall and supplies steam also by pipes 10, 11 introduced from the one side 4A of the wall into the steam chambers 6, 9 and extending toward the other side 4B of the wall.
申请公布号 JP2011212843(A) 申请公布日期 2011.10.27
申请号 JP20100080248 申请日期 2010.03.31
申请人 SEKISUI PLASTICS CO LTD 发明人 UJIHARA SUSUMU
分类号 B29C44/00 主分类号 B29C44/00
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