| 摘要 |
A camera module includes a holder, a barrel, an image sensor module, and a printed circuit board. The barrel receives lenses. The barrel is received in the holder. The image sensor module includes a substrate and an image sensor. The substrate is positioned at one side of the holder. The image sensor is mounted on the substrate and aligned with the lenses. First solder pads are positioned in the substrate. The first solder pads are electrically coupled to the image sensor. The printed circuit board includes second solder pads. The second solder pads are electrically coupled to the first solder pads. The printed circuit board is positioned at an exterior surface of the holder.
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