发明名称 BACK END OF LINE METAL-TO-METAL CAPACITOR STRUCTURES AND RELATED FABRICATION METHODS
摘要 Apparatus and related fabrication methods are provided for capacitor structures. One embodiment of a capacitor structure comprises a plurality of consecutive metal layers and another metal layer. Each via layer of a plurality of via layers is interposed between metal layers of the plurality of metal layers. The plurality of metal layers and the plurality of via layers are cooperatively configured to provide a first plurality of vertical conductive structures corresponding to a first electrode and a second plurality of vertical conductive structures corresponding to a second electrode. The plurality of consecutive metal layers form a plurality of vertically-aligned regions and provide intralayer electrical interconnections among the first plurality of vertical conductive structures. The first metal layer provides an intralayer electrical interconnection among the second plurality of vertical conductive structures, wherein each vertically-aligned region has a vertical conductive structure of the second plurality of vertical conductive structures disposed therein.
申请公布号 US2011261500(A1) 申请公布日期 2011.10.27
申请号 US20100765575 申请日期 2010.04.22
申请人 FREESCALE SEMICONDUCTOR, INC. 发明人 PARRIS PATRICE M.;DE SOUZA RICHARD J.;CHEN WEIZE;ZITOUNI MOANISS
分类号 H01G4/00;B05D5/12 主分类号 H01G4/00
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