发明名称 METHOD FOR MANUFACTURING CIRCUIT BODY, AND WIRE HARNESS
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit body, which can achieve cost reduction of a wire harness by reducing the transportation cost required for outer packaging components, inventory management cost, and spaces required for a factory, as well as to provide the wire harness.SOLUTION: The wire harness as the circuit body is obtained as described below. In a step S1, a long core wire constructed of a conductive metal is cut in a predetermined length. In a step S2, an end portion of the core wire is molded in a terminal part and the core wire is bent in a predetermined shape. In a step S3, a covering part is integrally molded in the center of the core wire. In a step S4, a rubber stopper is integrally molded in an end portion of the covering part. In a step S5, a conductor thin film sheet and a shield shell are assembled. In a step S6, a connector housing is integrally molded. In a step S7, a packing is integrally molded. In a step S8, a protective part is integrally molded.
申请公布号 JP2011216454(A) 申请公布日期 2011.10.27
申请号 JP20100101147 申请日期 2010.04.26
申请人 YAZAKI CORP 发明人 ITO KOTA;SUZUKI KATSUSATO
分类号 H01B13/012;H01B7/00;H01R13/52;H01R43/24 主分类号 H01B13/012
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