发明名称 METHOD FOR CLEANING OF SEMICONDUCTOR WAFER
摘要 PROBLEM TO BE SOLVED: To provide a method for cleaning of a semiconductor wafer, capable of effectively preventing a fact that a migrant moves to the semiconductor wafer removed from a silicone rubber-made sticky sheet to cause contamination, and inconveniences occur in later steps.SOLUTION: A semiconductor wafer W is detachably, stickily held to a flat surface of the silicone rubber-made sticky sheet, this semiconductor wafer W is performed a predetermined treatment, and then the semiconductor wafer W is peeled from the sticky sheet to plasma-clean at least the other side sticky to the sticky sheet by a plasma cleaner 10. Even if siloxane of silicone rubber moves and adheres to the semiconductor wafer W from the sticky sheet, as siloxane is decomposed and cleaned by oxygen plasma, it is possible to wash out the risk that troubles occur in later manufacturing steps by contamination of the semiconductor wafer W.
申请公布号 JP2011216542(A) 申请公布日期 2011.10.27
申请号 JP20100080834 申请日期 2010.03.31
申请人 SHIN ETSU POLYMER CO LTD 发明人 ODAJIMA SATOSHI
分类号 H01L21/304 主分类号 H01L21/304
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