| 摘要 |
An epoxy resin composition for photosemiconductor element encapsulation having small internal stress and excellent light transmissibility is provided. A cured product formed from an epoxy resin composition for photosemiconductor element encapsulation containing the following components (A) to (D). In the above-described cured product, particles of the component (C) silicone resin are homogeneously dispersed, with the particle size being 1 to 100 nm. (A) an epoxy resin, (B) an acid anhydride curing agent, (C) a silicone resin capable of being melt-mixed with the component (A) epoxy resin, and (D) a curing accelerator. |
