发明名称 High efficiency electro-static chucks for semiconductor wafer processing
摘要 The present invention generally provides a high efficiency electrostatic chuck for holding a substrate in a processing volume. The high efficiency electrostatic chuck includes an electrode embedded within a high-purity, thermoplastic member. In particular, the high-purity, thermoplastic member may include a high-purity, polyaryletherketone having an extremely low level of metallic ions present therein. The high-purity, polyaryletherketone has excellent wear resistance, high temperature resistance, plasma resistance, corrosive chemical resistance, electrical stability, and strength as compared to polyimide films used in electrostatic chucks. The present invention also provides a simplified method of manufacturing the high efficiency electrostatic chuck.
申请公布号 US8043433(B2) 申请公布日期 2011.10.25
申请号 US20080028883 申请日期 2008.02.11
申请人 APPLIED MATERIALS, INC. 发明人 BHATNAGAR ASHISH
分类号 H02N13/00 主分类号 H02N13/00
代理机构 代理人
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