| 发明名称 |
Product and method for integration of deep trench mesh and structures under a bond pad |
| 摘要 |
A structure includes a substrate. A trench structure is arranged within the substrate. A film is placed under an interlevel dielectric pad and between portions of the trench structure.
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| 申请公布号 |
US8044510(B2) |
申请公布日期 |
2011.10.25 |
| 申请号 |
US20080256089 |
申请日期 |
2008.10.22 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GEBRESELASIE EPHREM G.;MOTSIFF WILLIAM T.;SAUTER WOLFGANG;VOLDMAN STEVEN H. |
| 分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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