| 摘要 |
An LED packaging method provides a package that includes a substrate, a LED chip, a carbon naonotube thin film and an adhesive layer. The LED chip includes an anode and a cathode. The carbon naonotube thin film includes at least two electrically conductive areas spaced from each other. The anode and the cathode are electrically connected to the adjacent electrically conductive areas. The adhesive layer is coated on the LED chip and the carbon nanotube thin film.
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