| 摘要 |
The present invention relates to a magnetron sputtering device including a large ring cathode (12) having a defined inner radius (r 1 ). The position of the ring cathode is offset in relation to a center point (C) of a planetary drive system. An anode or reactive gas source may be located within the inner radius of the ring cathode. Lower defect rates are obtained through the lower power density at the cathode which suppresses arcing, while runoff is minimized by the cathode to planet geometry without the use of a mask. |
