| 摘要 |
A first aspect of this invention provides a method for cleaning a semiconductor substrate with excellent safety, capable of not damaging a gate insulating film or the substrate and so on, and efficiently stripping impurities, especially adhesion objects such as ion-implanted resist and so on, adhered on the semiconductor substrate. The method for cleaning the semiconductor substrate of this invention is implemented by providing a blowing agent component and a blowing promoter component to the semiconductor substrate, and cleaning the semiconductor substrate in a mixture of the blowing agent component and the blowing promoter component, wherein the blowing agent component contains carbonates, the blowing promoter component contains acid compounds, and pH of the mixture is below 7.5. |
