| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of peeling of members and crack in sealing resins within a semiconductor device.SOLUTION: The semiconductor device includes a semiconductor element, a die-pad having plane size smaller than that of the semiconductor element, a plurality of hanging leads extended from the die-pad, and a sealing resin for covering the semiconductor element, the die-pad, and the hanging leads. In the hanging lead, the width of the first principal plane connected to the semiconductor element loading surface in the die-pad is set smaller than that of the second principal plane continued to the other plane of the die-pad. Therefore, the hanging lead can prevent peeling between the semiconductor element and the hanging lead itself by reducing a contact area thereof when these elements are placed in contact with each other and also can prevent generation of crack in the sealing resin by avoiding concentration of stress generated under the heated condition. |
