| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device reducing power consumption and cost.SOLUTION: In the semiconductor device 100 that a plurality of chips 1, 2 are built into the same package, the chips 1, 2 include signal I/O terminals 101, 201 for external connection connecting the chips 1, 2 with external portions, and signal I/O terminals 102, 202 for inter-chip connection connecting between the chips 1, 2. The signal voltage amplitude of the signal I/O terminal 102, 202 for inter-chip connection is made smaller than that of the signal terminal 101, 201 for external connection. |
