| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which has a wiring conductor formed by a subtractive method, the wiring board securing a necessary wiring width on a surface of the wiring conductor and also securing a sufficient insulation interval on a side coming in contact with an insulating layer, and to provide a method of manufacturing the wiring board.SOLUTION: A metal layer 2P is etched, with a first etchant containing a side-etching inhibitor, in such a manner that the metal layer 2P increases in width from the side of an etching resist layer 3 to the side of the insulating layer 1, and then the metal layer 2P is etched, with a second etchant whose etching speed inversely depends upon a stirring speed of the etchant, in such a manner that the metal layer 2P increases in width from the side of the etching layer 3 to a thickness center part of the metal layer 2P and also decreases in width from the thickness center part of the metal layer 2P to the side of the insulating layer 1, and thus the wiring conductor 2 is formed. |
