发明名称 |
LIGHT EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME |
摘要 |
<p>The present invention relates to a light emitting diode (LED), which enables a filler material for filling up a hole or opening of a substrate to prevent a resin of an encapsulant formed on the substrate from leaking and to enhance cohesion between the substrate and a resin portion formed in the hole or opening, and a method for fabricating the LED package. According to an embodiment of the present invention, there is provided an LED package, which comprises an LED chip; a substrate having the LED chip mounted thereon, the substrate having a hole or opening formed therein; an encapsulant formed on the substrate to encapsulate the LED chip; a resin portion for filling in the hole or opening; and a filler material for filling up a gap between the resin portion and the substrate.</p> |
申请公布号 |
WO2011129518(A1) |
申请公布日期 |
2011.10.20 |
申请号 |
WO2011KR00479 |
申请日期 |
2011.01.24 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD.;YOON, SUN JIN;OH, KWANG YONG;BAE, YUN JEONG |
发明人 |
YOON, SUN JIN;OH, KWANG YONG;BAE, YUN JEONG |
分类号 |
H01L33/52;H01L33/56 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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