METHOD FOR MANUFACTURING COMPOUND BALL FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a compound ball for electronic components having a smooth surface by eliminating unevenness on the surface of a solder plating layer.SOLUTION: This is a manufacturing method of a compound ball for electronic components which has a solder plating layer on the surface of a spherical core ball. The method includes a process of smoothing the surface of the solder plating layer while bringing the compound balls in contact with each other in a rotation drum which holds an aqueous solution containing ≥0.10 mol/L ammonia. The pH of the aqueous solution is desirably 4-6.