| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laminated package capable of laminating a plurality of semiconductor packages without increasing a forming area of the package, and a method for manufacturing the package.SOLUTION: A package connection substrate includes a joining pad physically and electrically connected to a mounting pad provided to a bottom surface of an upper package at a top surface of a lower package; and a wiring path for electrically connecting a chip pad of a semiconductor IC chip in the lower package and the joining pad. The package connection substrate is fixed to the top surface of the semiconductor IC chip in the lower package. |
