发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having favorable lithographic characteristics and dispersibility in a solvent, and suppressing a residue or blushing after development.SOLUTION: The photosensitive resin composition contains a polyimide resin, a photosensitive agent, a carboxyl group-containing triazole compound expressed by formula (1), at least one organic solvent selected from a group consisting of an amide solvent that dissolves the carboxyl group-containing triazole compound, a lactone solvent and a 1-10C alcohol solvent having at least two alcoholic hydroxyl groups in the molecule. In formula (1), Rand Reach represent a 1-20C organic group and may be identical or different from each other; and n represents an integer of 1 to 4.
申请公布号 JP2011209535(A) 申请公布日期 2011.10.20
申请号 JP20100077535 申请日期 2010.03.30
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 IIZUKA YASUSHI;INABA AYA
分类号 G03F7/004;G03F7/022;H01L21/027 主分类号 G03F7/004
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