发明名称 COPPER FOIL FOR PRINTED WIRING BOARD AND LAYERED BODY WHICH HAVE SUPERIOR HEATING DISCOLORATION RESISTANCE AND ETCHING PROPERTY
摘要 PROBLEM TO BE SOLVED: To provide a copper foil for a printed wiring board and a layered body which have superior heating discoloration resistance and etching properties.SOLUTION: The copper foil for the printed wiring board includes a copper foil base material and a coating layer which covers at least a part of a surface of the copper foil base material and includes at least one or more kinds among Au, Pt and Pd, the coating layer being composed of noble metal particles of one or more kinds among Au, Pt and Pd and a silane coupling agent covering the noble metal particles.
申请公布号 JP2011210984(A) 申请公布日期 2011.10.20
申请号 JP20100077803 申请日期 2010.03.30
申请人 JX NIPPON MINING & METALS CORP 发明人 FURUSAWA HIDEKI;MURATA MASATERU;CHUGANJI MISATO
分类号 H05K1/09;H05K1/03;H05K3/24 主分类号 H05K1/09
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