发明名称 |
COPPER FOIL FOR PRINTED WIRING BOARD AND LAYERED BODY WHICH HAVE SUPERIOR HEATING DISCOLORATION RESISTANCE AND ETCHING PROPERTY |
摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil for a printed wiring board and a layered body which have superior heating discoloration resistance and etching properties.SOLUTION: The copper foil for the printed wiring board includes a copper foil base material and a coating layer which covers at least a part of a surface of the copper foil base material and includes at least one or more kinds among Au, Pt and Pd, the coating layer being composed of noble metal particles of one or more kinds among Au, Pt and Pd and a silane coupling agent covering the noble metal particles. |
申请公布号 |
JP2011210984(A) |
申请公布日期 |
2011.10.20 |
申请号 |
JP20100077803 |
申请日期 |
2010.03.30 |
申请人 |
JX NIPPON MINING & METALS CORP |
发明人 |
FURUSAWA HIDEKI;MURATA MASATERU;CHUGANJI MISATO |
分类号 |
H05K1/09;H05K1/03;H05K3/24 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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