发明名称
摘要 A support for a semiconductor wafer includes a plate having a support surface for supporting the wafer and a recessed surface spaced from the support surface and spaced from the wafer. A plurality of holes extends from the recessed surface, and the support surface is free of holes to inhibit contamination of the wafer.
申请公布号 JP2011527109(A) 申请公布日期 2011.10.20
申请号 JP20110516492 申请日期 2009.06.22
申请人 发明人
分类号 H01L21/683 主分类号 H01L21/683
代理机构 代理人
主权项
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