| 摘要 |
A surface inspection device (1) includes: a stage (10) for supporting a wafer (W); an illumination system (20) for illuminating with ultraviolet light a surface of the wafer (W) supported by the stage (10); a light reception system (30) for forming an image on a predetermined imaging surface with the light from the surface of the wafer (W); a camera unit (34) for capturing an image of the wafer (W) formed on the imaging surface by the light reception system (30); a pixel compensation drive unit (35) for performing pixel compensation; a control unit (40) for controlling the operation of the pixel compensation drive unit (35) and the camera unit (34) so that the camera unit (34) captures images of a plurality of wafers (W) while performing pixel compensation using the pixel compensation drive unit (35); and an image processing unit (45) for generating a synthesized image of the wafer (W) by successively arranging the pixels in the plurality of images captured by the camera unit (34) in the order based on the pixel compensation. |
