| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a photoelectric wiring board, in which the number of processes required until its production is reduced.SOLUTION: The method for manufacturing a photoelectric wiring board includes: a step 1 of producing an optical waveguide having an optical transmission part capable of transmitting an optical signal inside on an electric substrate having a conductive layer on its surface; a step 2 of producing a first through-hole having a base where the conductive layer is exposed, and a second through-hole having a slope which is inclined toward the electric substrate to an optical axis direction of the optical transmission part and where the optical transmission part of the optical waveguide is exposed in the optical waveguide; and a step 3 of producing a through-conductor and a light reflection surface by simultaneously forming a metal film on an inner wall surface of the first through-hole and the slope of the second through-hole. |
