PHOTORESIST FILM AND METHODS FOR ABRASIVE ETCHING AND CUTTING

摘要

A photoresist film and method of using the photoresist film is described. The photoresist film allows for fine-detail abrasive blasting of substrates without the use of organic solvents for development. The photoresist film can be formed without the use of a membrane or adhesive layer, both of which are typically used to secure one side of the photoresist film to a carrier and one side of the photoresist film to a substrate. The photoresist films of the present invention typically include an ethylene-vinyl acetate copolymer ("EVA"), a polyvinyl acetate ("PVAc"), and a photo polymer. Suitable photopolymers include polyvinyl alcohol photopolymers.