| 摘要 |
<p>Putty-like gap-filling compounds (40) for insulation that can be utilized at temperatures from about -420°F (-250°C) up to about 500°F (260°C) are described herein. Embodiments of these compounds contain about 25-50 volume percent base material, about 50-75 volume percent microspheres, and about 0.1-0.3 volume percent catalyst. Embodiments of these compounds contain about 70-80 weight percent base material, about 20-30 weight percent microspheres, and about 0.1-0.5 weight percent catalyst.</p> |
