发明名称 Power semiconductor module with connection elements
摘要 The module has two connection elements (70, 80), which comprise two contact sections (76, 86) and other two contact sections (72, 82), and resilient sections (74, 84) arranged between the contact sections. The latter contact sections of the connection elements comprise an electrically-conductive contact with a substrate (30). A housing (50) comprises openings (56, 58) for arranging the connection elements. The resilient sections are formed as screw springs, and partially enclose one of the connection elements. The openings are separated from each other by an insulating material sleeve (54).
申请公布号 EP2378552(A1) 申请公布日期 2011.10.19
申请号 EP20110151487 申请日期 2011.01.20
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG 发明人 LEDERER, MARCO;POPP, RAINER
分类号 H01L23/00;H01L23/48;H01L25/07;H01R12/52;H01R12/57;H01R13/24 主分类号 H01L23/00
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