| 摘要 |
A resin sealing type circuit device is disclosed having a circuit case, made of resin, which has a recessed portion, a plurality of circuit elements accommodated in the recessed portion and having lead terminals, respectively, wiring metal segments fixedly supported with the circuit case and having lead terminal connecting portions protruding into the recessed portion, and a sealing resin filled in the recessed portion and covering the plurality of circuit elements and the lead terminal connecting portions of the wiring metal segments, wherein placements of the plurality of circuit elements are determined in consideration for a temperature distribution of the sealing resin. |
