发明名称 |
FILM ADHESIVE AND ANISOTROPIC CONDUCTIVE ADHESIVE |
摘要 |
Provided is a film adhesive that has a high flexibility and a high adhesion strength and is easy to prepare by mixing. The film adhesive contains, as essential components, a bisphenol A phenoxy resin having a molecular weight of 30,000 or more, an epoxy resin having a molecular weight of 500 or less, a glycidyl methacrylate copolymer, a rubber-modified epoxy resin, and a latent hardener. Preferably, the weight of the glycidyl methacrylate copolymer per epoxy equivalent is 1000 or less. |
申请公布号 |
EP2377903(A1) |
申请公布日期 |
2011.10.19 |
申请号 |
EP20090834689 |
申请日期 |
2009.12.03 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
TOSHIOKA, HIDEAKI;OKUDA, YASUHIRO |
分类号 |
C09J7/00;C09J11/04;C09J133/14;C09J163/00;C09J171/10;H01B1/00;H01B1/20;H01B5/16;H01L21/52;H01L21/60 |
主分类号 |
C09J7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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