发明名称 |
Method for manufacturing a wiring board |
摘要 |
A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer covering the uppermost wiring layer, wherein the thickness of the portion of the uppermost wiring layer is larger than that of other portions thereof.
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申请公布号 |
US8037596(B2) |
申请公布日期 |
2011.10.18 |
申请号 |
US20070946360 |
申请日期 |
2007.11.28 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MURAMATSU SHIGETSUGU;KUSAMA YASUHIKO |
分类号 |
H05K3/02;H05K1/00 |
主分类号 |
H05K3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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