发明名称 Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a module
摘要 The module is of the type comprising an electronic component provided with a conductive face that is electrically connected to a connection member of the component by means of a conductor that is corrugated at least in part so as to define an alternating sequence of oppositely-directed arcs, a first series of arcs being connected to the conductive face of the electronic component. The conductor also includes a second series of arcs opposite to the arcs of the first series and interposed between the arcs of the first series, the second series of arcs being connected to the conductive face of the connection member.
申请公布号 US8039973(B2) 申请公布日期 2011.10.18
申请号 US20070223071 申请日期 2007.01.30
申请人 VALEO ETUDES ELECTRONIQUES 发明人 MORELLE JEAN-MICHEL;VIVET LAURENT;MEDINA MATHIEU;LEON RENAN
分类号 H01L23/48;H01L23/52;H01L29/40 主分类号 H01L23/48
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