发明名称 |
Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same |
摘要 |
A multilayered wiring board has electrodes disposed on a first surface and a second surface, alternately layered insulation layers and wiring layers, and vias that are disposed in the insulation layer and electrically connect the wiring layers. The second electrode disposed on the second surface is embedded in the insulation layer exposed on said second surface, and the second wiring layer covered by the insulation layer exposed on said second surface does not have a layer for improving adhesion to the insulation layer.
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申请公布号 |
US8039756(B2) |
申请公布日期 |
2011.10.18 |
申请号 |
US20060542309 |
申请日期 |
2006.10.04 |
申请人 |
NEC CORPORATION;RENESAS ELECTRONICS CORPORATION |
发明人 |
KIKUCHI KATSUMI;YAMAMICHI SHINTARO;KURITA YOICHIRO;SOEJIMA KOJI |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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