发明名称 Thin film transistor, method of manufacturing same, display device, method of modifying an oxide film, method of forming an oxide film, semiconductor device, method of manufacturing semiconductor device, and apparatus for manufacturing semiconductor device
摘要 In a manufacturing method of a thin film transistor (1), the oxide film forming step is performed whereby: a process-target substrate (2) having a surface on which a gate oxide film (4) should be formed is immersed in an oxidizing solution containing an active oxidizing species; and a gate oxide film (4) is formed through direct oxidation of polycrystalline silicon (51) on the process-target substrate (2). With this step, a silicon dioxide film (42) is formed while growing a silicon dioxide film (41) on the process-target substrate 2. Accordingly, the interface between the polycrystalline silicon (51) and the gate oxide film (4) is kept clean. The gate oxide film (4) is uniformly formed with excellent quality in insulation tolerance and other properties. Therefore, the thin film transistor (1) contains a high quality oxide film with excellent insulation tolerance and other properties which can be formed at low temperature.
申请公布号 US8039403(B2) 申请公布日期 2011.10.18
申请号 US20080336761 申请日期 2008.12.17
申请人 SHARP KABUSHIKI KAISHA 发明人 IMAI SHIGEKI;INOGUCHI KAZUHIKO;KOBAYASHI HIKARU
分类号 H01L21/31;H01L21/316;H01L21/321;H01L21/336;H01L29/49 主分类号 H01L21/31
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