发明名称 Conductive spacers for semiconductor devices and methods of forming
摘要 A method of forming a conductive spacer on a semiconductor device. The method includes depositing a polysilicon layer on the semiconductor device, selectively implanting dopant ions in the polysilicon layer on a first side of a transistor region of the semiconductor device to define a conductive spacer area, and removing the polysilicon layer except for the conductive spacer area. Optionally, a silicidation process can be performed on the conductive spacer area so that the conductive spacer is made up of metal silicide.
申请公布号 US8039888(B2) 申请公布日期 2011.10.18
申请号 US20070848597 申请日期 2007.08.31
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BRONNER GARY BELA;FRIED DAVID MICHAEL;GAMBINO JEFFREY PETER;CHANG LELAND;DIVAKARUNI RAMACHANDRA;YIN HAIZHOU;COSTRINI GREGORY;SARDESAI VIRAJ Y.
分类号 H01L29/788;H01L21/336 主分类号 H01L29/788
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