| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold release film which is superior in peelability from a mold and a molding obtained by molding a mold resin and has heat-resistant strength without melt-cutting the film even at a use temperature exceeding 200°C.SOLUTION: A fluorosilicone compound layer is formed on at least one side of a film. The film is obtained by molding a resin composition comprising a thermoplastic resin or a resin composition which mainly contains a thermoplastic resin and is mixed with a thermoplastic elastomer. The fluorosilicone compound layer is obtained by applying a mold release composition containing a fluorosilicone compound having a silyl group including a hydrolyzable part in a molecule on the film and drying it. |
